HS 84.86.10

Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers

WCO HS 20226-digit subheading
HS 84.86.10WCO HS 2022
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers
Section
XVI
Machinery and mechanical appliances; electrical equipment; parts thereof; sound recorders and reproducers, television image and sound recorders and reproducers, and parts and accessories of such articles
Chapter
84
Machinery and mechanical appliances, boilers, nuclear reactors; parts thereof
Heading
84.86
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines & apparatus specified in note 11 (C) to this Chapter
Level
Subheading
International 6-digit level (WCO HS 2022)
World Customs Organization (HS 2022)checked 2026-07-24verified

This is the international 6-digit HS code. Your country may use additional digits for national tariff purposes. For UK tariff and duty rates, check the UK Trade Tariff. For US rates, check the USITC HTS.

Related Codes Under 84.86

84.86.20
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor devices or of electronic integrated circuits
84.86.30
Machines and apparatus of a kind used solely or principally for the manufacture of flat panel displays
84.86.40
Machines and apparatus of a kind used solely or principally for the manufacture or repair of masks and reticles, assembling semiconductor devices or electronic integrated circuits, or for lifting, handling, loading or unloading items of heading 8486
84.86.90
Machines and apparatus of heading 8486; parts and accessories
← Heading 84.86: Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines & apparatus specified in note 11 (C) to this Chapter

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